In partnership with Priest Corporation, Rensselaer Polytechnic Institute has recently introduced a groundbreaking, low-cost, and fast-curing polymer that promises to revolutionize semiconductor manufacturing and chip packaging. This innovative material, known as epoxy-silicone-polyester resin (PES), enables a new generation of affordable nanoimprint lithography for chips, significantly cutting down on production costs and boosting efficiency.
One of the key advantages of PES is its ability to streamline the manufacturing process. Chip manufacturers can eliminate several time-consuming steps from production to packaging, leading to substantial cost reductions. Additionally, PES cures at a lower temperature—165°C—compared to traditional materials, which typically require around 200°C. This 35% reduction in curing temperature not only saves energy but also reduces thermal stress on components during production.
Another standout feature of PES is its minimal water absorption, less than 0.2%, which outperforms most conventional materials. This makes it highly suitable for use in environments where moisture resistance is critical. Moreover, PES exhibits excellent adhesion properties, particularly when bonding with copper, a common material used in chip interconnects.
These combined benefits position PES as a strong contender for advanced applications such as redistribution layer (RDL) technology and UV imprint lithography. As the semiconductor industry continues to push for more efficient and cost-effective solutions, PES represents a significant step forward in materials innovation, offering both performance and economic advantages.
A pallet truck is a light and small handling equipment with two cargo-like legs. Can be inserted into the free fork hole of the pallet. Widely used in loading, unloading or handling operations.
Semi-electric lifting truck, manual truck, fully automatic lifting truck
Taixing Jinlong Rubber Rollers Co., Ltd. , https://www.jinlongroller.com