In partnership with Priest Corporation, Rensselaer Polytechnic Institute has introduced a groundbreaking, low-cost, and fast-curing polymer material that promises to revolutionize semiconductor manufacturing and chip packaging. This innovative material, known as epoxy-silicone-polyester resin (PES), enables a new generation of cost-effective nanoimprint lithography for chips, significantly improving production efficiency while cutting down on expenses.
One of the key advantages of PES is its ability to streamline the manufacturing process. By eliminating several steps in both production and packaging, it helps reduce overall costs. Additionally, the curing temperature of PES is just 165°C, which is 35% lower than that of traditional materials. This means less energy is required during fabrication, making the process more sustainable and cost-efficient.
Another notable feature of PES is its extremely low water absorption—less than 0.2%, which outperforms most conventional materials. This property ensures better long-term stability and performance in various environments. Moreover, PES exhibits excellent adhesion to copper, making it an ideal candidate for redistribution layer applications and UV imprint lithography.
With these combined benefits, PES is quickly gaining attention from industry leaders as a promising solution for next-generation chip manufacturing. Its versatility, cost-effectiveness, and superior performance make it a strong contender for widespread adoption in the semiconductor sector. As research continues, we can expect to see even more applications and innovations driven by this remarkable material.
Rubber Conveyor Roller,Pressure Resistance Roller,Corrosion Resistance Roller,High Temperature Resistance Roll
Taixing Jinlong Rubber Rollers Co., Ltd. , https://www.jinlongroller.com